Haptics and microphone display integration

ABSTRACT

Microphones are located between pixel display elements (e.g., micro-LEDs and OLEDs) in a display. Display-integrated microphones allow displays to have thinner bezels. Audio processing components can also be incorporated into the display and allow audio processing offloading from processors external to the display. Arrays of microphones allow for the beamforming of received audio signals to enhance the detection of sound from remote audio sources. Piezoelectric elements can also be integrated into a display to allow for localized haptic feedback. Integrated piezoelectric elements can act as speakers and beamforming techniques can be used to activate sets of piezoelectric elements in coordination to direct sound to a specific location external to the display. Piezoelectric elements can aid in display thermal management by creating acoustic waves to move heated air within a display to create a more uniform thermal profile within the display or to remove excess heat from the display.

BACKGROUND

Microphones are commonly incorporated into mobile computing devices.Laptops, notebooks, and mobile devices with similar form factorstypically have one or a small number of microphones located in the bezelof the display housing. These microphones are typically discrete innature, mounted on a dedicated substrate, and use discrete wires toconnect to audio processors located external to the display. Touchcapabilities are also commonplace in mobile computing devices. Mobiledevices can detect the touch of a user's finger or other objects on adisplay and determine where the touch occurred on the display. Somemobile devices also possess haptic capabilities that cause the device tovibrate in response to various events.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an exemplary display.

FIGS. 2A-2C illustrate exemplary arrangements of front-facingmicrophones in a display.

FIGS. 3A-3B illustrate simplified cross-sections of exemplary pixels indisplays.

FIG. 4A illustrates a set of exemplary pixels with integratedmicrophones.

FIG. 4B illustrates a cross-section of the exemplary pixels of FIG. 4Ataken along the line A-A′.

FIGS. 4C-4D illustrate exemplary microphones that span multiple pixels.

FIG. 5 illustrates an exemplary method for enhancing the audio detectioncapabilities of a display.

FIGS. 6A and 6B illustrate an exemplary piezoelectric element undervarious operating conditions.

FIG. 7A illustrates a set of exemplary pixels with an integratedpiezoelectric element located on the back side of a display substrate.

FIG. 7B illustrates a cross-section of the exemplary pixels of FIG. 7Ataken along the line A-A′.

FIGS. 8A-8C illustrate exemplary arrangements of piezoelectric elementsin a display.

FIG. 9 illustrates an exemplary method for providing localized hapticfeedback to a user of a virtual keyboard.

FIG. 10 illustrates an exemplary computing system with sensorsintegrated into a display.

FIG. 11 is a block diagram of an exemplary computing device in whichtechnologies described herein may be implemented.

FIG. 12 is a block diagram of an exemplary processor core that canexecute instructions as part of implementing technologies describedherein.

DETAILED DESCRIPTION

Mobile device sensors are typically limited to where they can be placedand how many of a particular type of sensor can be placed in a device.For example, laptop and notebook microphones are typically placed in thebezel of the display and are usually limited to one to four in number.The low number of microphones and constraints on their placement limitsthe audio capabilities of these devices. For example, having only a fewmicrophones limits far-field audio capabilities. Further, since themicrophones are typically integrated into the front-facing surface ofthe bezel, the microphones are positioned up against the base of thedevice when the device is closed, meaning the closed device typicallyhas no or very limited audio capabilities. To include more microphonesin these devices may enable increased audio functionality but wouldlikely do so at the expense of an increased bezel width, which canimpact device aesthetics. Adding more microphones in the bezel may alsoincrease system complexity and cost due to the routing of additionalaudio signals from the microphones to audio processing componentslocated external to the display.

The size of the display elements responsible for generating light in adisplay pixel or allowing for the transmission of light through eachpixel continues to shrink over time. Even at the higher resolutions usedin existing consumer electronics displays (e.g., 1920×1080 (Full HD),3840×2160 (4K HD)), display elements can take up only a portion of thearea of a pixel. If the black matrix area of a display (the area of thefront side of the display substrate not occupied by display elements)has enough unused space, additional elements, such as microphones, canbe incorporated into individual pixels. Moving microphones from thedisplay bezel to the display area allows for a reduced bezel width andfor many microphones to be incorporated into a display. A larger numberof microphones in a device can allow for improved audio detection, noisereduction, and far-field capabilities. Microphones located on a displaysubstrate can be located in the display bezel if the display substrateextends into the bezel area. Such microphones also allow for a reducedbezel relative to bezels housing discrete microphones.

The incorporation of additional sensors, such as rear-facing microphonesand piezoelectric elements, allows for additional displayfunctionalities. If incorporated into a laptop display, rear-facingmicrophones can provide audio detection capabilities when the laptop isclosed. Piezoelectric elements incorporated into a display allow forimproved haptic capabilities in a device. For example, when combinedwith a touchscreen, piezoelectric elements incorporated into a displaycan provide localized haptic feedback to a user, which can allow for animproved user experience.

In the following description, specific details are set forth, butembodiments of the technologies described herein may be practicedwithout these specific details. Well-known circuits, structures, andtechniques have not been shown in detail to avoid obscuring anunderstanding of this description. “An embodiment,” “variousembodiments,” “some embodiments,” and the like may include features,structures, or characteristics, but not every embodiment necessarilyincludes the particular features, structures, or characteristics.

Some embodiments may have some, all, or none of the features describedfor other embodiments. “First,” “second,” “third,” and the like describea common object and indicate different instances of like objects beingreferred to. Such adjectives do not imply objects so described must bein a given sequence, either temporally or spatially, in ranking, or inany other manner. “Connected” may indicate elements are in directphysical or electrical contact with each other and “coupled” mayindicate elements co-operate or interact with each other, but they mayor may not be in direct physical or electrical contact. Terms modifiedby the word “substantially” include arrangements, orientations, spacingsor positions that vary slightly from the meaning of the unmodified term.For example, a microphone located substantially at the center of adisplay includes microphones located within a few pixels of the centerof the display.

The description may use the phrases “in an embodiment,” “inembodiments,” “in some embodiments,” and “in various embodiments,” eachof which may refer to one or more of the same or different embodiments.Furthermore, the terms “comprising,” “including,” “having,” and thelike, as used with respect to embodiments of the present disclosure, aresynonymous.

Reference is now made to the drawings, wherein similar or same numbersmay be used to designate the same or similar parts in different figures.The use of similar or same numbers in different figures does not meanall figures including similar or same numbers constitute a single orsame embodiment. In the following description, for purposes ofexplanation, numerous specific details are set forth in order to providea thorough understanding thereof. It may be evident, however, that thenovel embodiments can be practiced without these specific details. Inother instances, well known structures and devices are shown in blockdiagram form in order to facilitate a description thereof. The intentionis to cover all modifications, equivalents, and alternatives within thescope of the claims.

Microphones

FIG. 1 illustrates an exemplary display. The display 100 comprises ahousing 110, a bezel 120, a display surface 130, and a display base 140.Located within the display area are front-facing microphones 150 (whitecircles), rear-facing microphones 160 (dark circles), and one or moreaudio processing components 170. The audio processing components 170 areelectrically coupled to one or more external processors 180. The display100 can be any type of display in which the display elements responsiblefor generating light or allowing for the transmission of light arelocated at each pixel. Such displays include TFT LCD(thin-film-transistor liquid crystal display), micro-LED (micro-lightemitting diode), OLED (organic LED), and QLED (quantum dot LED)displays. The housing 110 comprises the bezel 120, which borders thedisplay surface 130. Display 100 comprises a display substrate (notshown in FIG. 1) on which a plurality of pixels (also not shown) islocated. The pixels define a display area 182 within which images,videos, and other content can be displayed. In display 100, the pixelsextend to interior edges 184 of the bezel 120 and the display area 182thus extends from one interior bezel edge 184 to the opposite bezel edge184 in both the horizontal and vertical directions. The front-facingmicrophones 150 are located on the front side of the display substrateand within the display area and the rear-facing microphones 160 arelocated on the back side of the display substrate. Being located on thefront side of the display substrate, the front-facing microphones 150share real estate with the pixel display elements, as will be discussedin greater detail below.

The front-facing microphones 140 are located within a peripheral region190 of the display area, the boundary of which is represented by dashedline 195. The peripheral region 190 is not defined as a set distancefrom the edge of the bezel 120 but is rather defined generally as theregion of the display area near the bezel 120. As small holes may bemade on the surface of the display 120 where the front-facingmicrophones 150 are located to allow acoustic vibrations to reach thefront-facing microphones 150, locating the front-facing microphones 150in the peripheral area 190 of the display 100 may create a more pleasantuser experience. However, the presence of small holes in a display doesnot limit the location of front-facing microphones to the periphery of adisplay; front-facing microphones can be placed at any location within adisplay area.

FIGS. 2A-2C illustrate exemplary arrangements of front-facingmicrophones in a display. FIG. 2A illustrates a display 200 in whichfront-facing microphones 210 include a set of microphones located inperipheral region 220 of a display area 230 and a microphone locatedsubstantially in the center of the display area 230. FIG. 2B illustratesa display 240 in which front-facing microphones 250 include a set ofmicrophones located in peripheral region 260 of display area 270 and aset of microphones located outside the peripheral region 260 of thedisplay area 270. FIG. 2C illustrates a display 280 in which an array offront-facing microphones 290 are within display area 295 of the display280. In other embodiments, a display can have a plurality offront-facing microphones that vary in number and arrangement from theexemplary configurations shown in FIGS. 1 and 2A-2C.

Returning to FIG. 1, the one or more audio processing components 170 cancomprise, for example, analog-to-digital converters, audio codecs, anddigital signal processors (DSPs). The audio processing components areelectrically coupled to front-facing microphones 150 and rear-facingmicrophones 160. Although display 100 is shown comprising both front-and rear-facing microphones, in some embodiments a display has onlyfront-facing microphones and in other embodiments a display has onlyrear-facing microphones. In embodiments comprising both front- andrear-facing microphones, the microphones can be electrically coupled tothe same audio processing components. In other embodiments, thefront-facing microphones can be electrically coupled to a first set ofaudio processing components and the rear-facing microphones can beelectrically coupled to a second set of audio processing components. Theanalog-to-digital converters and audio codecs can convert analog audiosignals received from the microphones to digital analog signals, and theDSPs can process the digital signals. In some embodiments, the DSPs canperform various audio-related functions such as voice activitydetection, key phrase detection, and audio speech recognition. Voiceactivity detection functionality detects the presence of human speech inaudio signals. Key phrase detection detects the presence of a word orphrase that causes one or more of the audio processing components orprocessors electrically coupled to the audio processing components (suchas external processor 180) to transition from a low-power state to anactive state. Audio speech recognition is one audio-related functionthat can be enabled in an active state and allows for the recognitionand translation of spoken language into text or commands. In someembodiments, audio speech recognition can cause a display or system towake from a low-power state upon detection of any spoken words, not justa specific word or phrase.

As the audio processing components 170 can perform audio processingtypically performed by processing resources external to the display inexisting devices, the audio processing components 170 allow for theoffloading of audio processing. Offloading audio processing fromprocessors external to the display can reduce the power consumption ofthe external processors, which can be of value if the external processoris in a mobile device operating on battery power. Moving audioprocessing components from external processors to the display, wherethey are closer to the microphones, can also provide latencyimprovements.

The audio processing components can also perform noise reduction. Noisereduction can be improved in displays with multiple integratedmicrophones distributed across a display as there are more audio signalsprovided by spatially diverse microphones to use in noise reductionapproaches. In some embodiments, the DSPs perform noise reduction,conduct beamforming with multiple microphones to enhance voice detectioncapabilities, detect the direction of a voice or other noise source andact to enhance audio reception. DSPs can also provide spatiality (i.e.,the location or direction of an audio source) and other features to anaudio signal which can enhance the user experience when the associatedsound is reproduced.

The audio processing components 170 are communicatively coupled to oneor more processors 180 located external to the display 100. The display100 is shown as a stand-alone display and as such the one or more audioprocessing components 170 can be in wired or wireless communication withone or more central processor units (CPUs), graphic processing units(GPUs), or systems-on-a-chip (SOCs) located in a laptop, tablet, smartphone, desktop, workstation or other computing device. In otherembodiments, the display 100 is integrated into a mobile device such asa smartphone, tablet, mobile gaming system and the audio processingcomponents 170 are in communication with processors incorporated withinthe mobile device. In still other embodiments, the display 100 can be anembedded display such as in an in-vehicle infotainment (IVI) system, akiosk, or in any other of a wide variety of consumer or commercialelectronic devices, such as television sets, commercial displayinstallations (trade shows, stadiums, shopping malls, etc.), andnavigation systems.

In some embodiments, additional processors or devices can beincorporated into the display to support additional function. Forexample, wireless communication functionality can be incorporated intothe display to allow for audio processing components to offload audioprocessing, such as audio speech recognition, to a remote server orcloud-based service.

FIGS. 3A-3B illustrate simplified cross-sections of pixels in exemplarydisplays. FIG. 3A is a simplified illustration of the cross-section of apixel in an exemplary micro-LED display. Micro-LED pixel 300 comprises adisplay substrate 310, a red LED 320, a green LED 321, a blue LED 322,electrodes 330-332, and a transparent display medium 340. The LEDs320-322 are the individual light-producing elements for the pixel 300,with the amount of light produced by each LED 320-322 being controlledby the associated electrode 330-332.

The LED stacks (red LED stack (layers 320 and 330), green LED stack(layers 321 and 331) and blue LED stack (layers 322 and 332)) can bemanufactured on a substrate using microelectronic manufacturingtechnologies. In some embodiments, the display substrate 310 is asubstrate different from the substrate upon which the LEDs stacks aremanufactured and the LED stacks are transferred from the manufacturingsubstrate to the display substrate 310. In other embodiments, the LEDstacks are grown directly on the display substrate 310. In bothembodiments, multiple pixels can be located on a single displaysubstrate and multiple display substrates can be assembled to achieve adisplay of a desired size.

The pixel 300 has a pixel width 344, which can depend on, for example,display resolution and display size. For example, for a given displayresolution, the pixel width 344 can increase with display size. For agiven display size, the pixel width 344 can decrease with increasedresolution. The pixel 300 has an unused pixel area 348, which is part ofthe black matrix area of a display. In some displays, the combination ofLED size, display size, and display resolution can be such that theunused pixel area 348 can be large enough to accommodate the integrationof components, such as microphones, within a pixel.

FIG. 3B is a simplified illustration of the cross-section of a pixel inan exemplary OLED display. OLED pixel 350 comprises a display substrate355, organic light-emitting layers 360-362, which are capable ofproducing red (layer 360), green (layer 361) and blue (layer 362) light,respectively. The OLED pixel 350 further comprises cathode layers365-367, electron injection layers 370-372, electron transport layers375-377, anode layers 380-382, hole injections layers 385-387, holetransport layers 390-392, and a transparent display medium 394. The OLEDpixel 350 generates light through application of a voltage across thecathode layers 365-367 and anode layers 380-382, which results in theinjection of electrons and holes into electron injection layers 370-372and hole injection layers 384-386, respectively. The injected electronsand holes traverse the electron transport layers 375-377 and holetransport layers 390-392, respectively, and electron-hole pairsrecombine in the organic light-emitting layers 360-362 to generatelight.

Similar to the LED stacks in micro-LED displays, OLED stacks (red OLEDstack (layers 365, 370, 375, 360, 390, 385, 380), green OLED stack(layers 366, 371, 376, 361, 391, 386, 381), and blue OLED stack (layers367, 372, 377, 362, 392, 386, 382), can be manufactured on a substrateseparate from the display substrate 355. In some embodiments, thedisplay substrate 355 is a substrate different from the substrate uponwhich the OLED stacks are transferred from the manufacturing substrateto the display substrate 355. In other embodiments, the OLED stacks aredirectly grown on the display substrate 355. In both types ofembodiments, multiple display substrate components may need to beassembled in order to achieve a desired display size. The transparentdisplay mediums 340 and 394 can be any transparent medium such as glass,plastic or a film. In some embodiments, the transparent display mediumcan comprise a touchscreen.

Again, similar to the micro-LED pixel 300, the OLED pixel 350 has apixel width 396 that can depend on factors such as display resolutionand display size. The OLED pixel 350 has an unused pixel area 398 and insome displays, the combination of OLED stack widths, display size, anddisplay resolution can be such that the unused pixel area 398 is largeenough to accommodate the integration of components, such asmicrophones, within a pixel.

As used herein, the term “display substrate” can refer to any substrateused in a display and upon which pixel display elements are manufacturedor placed. For example, the display substrate can be a backplanemanufactured separately from the pixel display elements (e.g.,micro-LED/OLEDs in pixels 300 and 350) and upon which pixel displayelements are attached, or a substrate upon which pixel display elementsare manufactured.

FIG. 4A illustrates a set of exemplary pixels with integratedmicrophones. Pixels 401-406 each have a red display element 411, greendisplay element 412, and blue display element 413, which can be, forexample, micro-LEDs or OLEDs. Each of the pixels 401-406 occupies apixel area. For example, the pixel 404 occupies pixel area 415. Theamount of pixel area occupied by the display elements 411-413 in eachpixel leaves enough remaining black matrix space for the inclusion ofminiature microphones. Pixels 401 and 403 contain front-facingmicrophones 420 and 421, respectively, located alongside the displayelements 411-413. As rear-facing microphones are located on the backside of the display substrate, they are not constrained by unused pixelarea or display element size and can be placed anywhere on the back sideof a display substrate. For example, rear-facing microphone 422straddles pixels 402, 403, 405, and 406.

FIG. 4B illustrates a cross-section of the exemplary pixels of FIG. 4Ataken along the line A-A′. Cross-section 450 illustrates thecross-section of pixels 401-403. Red display elements 412 andcorresponding electrodes 430 for the pixels 401-403 are located ondisplay substrate 460. The pixels 401-403 are covered by transparentdisplay medium 470 that has holes 474 above microphones 420 and 421 toallow for acoustic vibrations reaching a display surface 475 to reachthe microphones 420 and 421. The rear-facing microphone 422 is locatedon the back side of the display substrate 460. In some embodiments, adisplay housing (not shown) in which pixels 401-403 are located hasvents or other openings to allow acoustic vibrations reaching the backside of the housing to reach rear-facing microphone 422.

In some embodiments, the microphones used in the technologies describedherein can be discrete microphones that are manufactured or fabricatedindependently from the pixel display elements and are transferred from amanufacturing substrate or otherwise attached to a display substrate. Inother embodiments, the microphones can be fabricated directly on thedisplay substrate. Although front-facing microphones are shown as beinglocated on the surface of the display substrate 460 in FIG. 4B, inembodiments where the microphones are fabricated on a display substrate,they can reside at least partially within the display substrate.

As used herein, the term “located on” in reference to any sensors(microphones, piezoelectric elements, thermal sensors) with respect tothe display substrate refers to sensors that are physically coupled tothe display substrate in any manner (e.g., discrete sensors that aredirectly attached to the substrate, discrete sensors that are attachedto the substrate via one or more intervening layers, sensors that havebeen fabricated on the display substrate). As used herein, the term“located on” in reference to LEDs with respect to the display substratesimilarly refers to LEDs that are physically coupled to the displaysubstrate in any manner (e.g., discrete LEDs that are directly attachedto the substrate, discrete LEDs that are attached to the substrate viaone or more intervening layers, LEDs that have been fabricated on thedisplay substrate). In some embodiments, front-facing microphones arelocated in the peripheral area of a display, such as peripheral area 190of display 100, to reduce any visual distraction that holes in thedisplay above the front-facing microphones (such as holes 474) maypresent to a user. In other embodiments, holes above a microphone maysmall enough or few enough in number such that they present little or nodistraction from the viewing experience.

Although the front-facing microphones 420 and 421 are each shown asresiding within one pixel, in other embodiments, front-facingmicrophones can straddle multiple pixels. This can, for example, allowfor the integration of larger microphones into a display area or formicrophones to be integrated into a display with smaller pixels. FIGS.4C-4D illustrate exemplary microphones that span multiple pixels. FIG.4C illustrates adjacent pixels 407 and 408 having the same size aspixels 401-406 and a front-facing microphone 425 that is bigger thanfront-facing microphones 420-421 and occupies pixel area not used bydisplay elements in two pixels. FIG. 4D illustrates adjacent pixels 409and 410 that are narrower in width than pixels 401-406 and afront-facing microphone 426 that spans both pixels. Using largermicrophones can allow for improved acoustic performance of a display,such as allowing for improved acoustic detection. Displays that havemany integrated miniature microphones distributed across the displayarea can have acoustic detection capabilities that exceed displayshaving just one or a few discrete microphones located in the displaybezel.

In some embodiments, the microphones described herein are MEMS(microelectromechanical systems) microphones. In some embodiments, themicrophones generate analog audio signals that are provided to the audioprocessing components and in other embodiments, the microphones providedigital audio signals to the audio processing components. Microphonesgenerating digital audio signals can contain a local analog-to-digitalconverter and provide a digital audio output in pulse-density modulation(PDM), I2S (Inter-IC Sound), or other digital audio signal formats. Inembodiments where the microphones generate digital audio signals, theaudio processing components may not comprise analog-to-digitalconverters. In some embodiments, the integrated microphones are MEMS PDMmicrophones having dimensions of approximately 3.5 mm (width)×2.65 mm(length)×0.98 mm (height).

As microphones can be integrated into individual pixels or acrossseveral pixels using the technologies described herein, a wide varietyof microphone configurations can be incorporated into a display. FIGS.1, 2A-2C, 3, and 4A-4D show several microphone configurations and manymore are possible.

The display-integrated microphones described herein generate audiosignals that are sent to one or more audio processing components, suchas audio processing component 170 in FIG. 1. The audio processingcomponents are typically located on the back side of the displaysubstrate. In some embodiments, audio signals generated by themicrophones are sent to the same one or more audio processingcomponents. In other embodiments, audio signals generated by differentsets of microphones are provided to different audio processingcomponents. In some embodiments, front-facing microphones are sent to afirst set of audio processing components and rear-facing microphones aresent to a second set of audio processing components. Theinterconnections providing the audio signals from the microphones to anaudio processing component can be located on the display substrate. Theinterconnections can be fabricated on the display substrate, attached tothe display substrate, or physically coupled to the display substrate inany other manner.

In some embodiments, display manufacture comprises manufacturingindividual display substrate portions to which pixels are attached andassembling the display substrate portions together to achieve a desireddisplay size. In these embodiments, the interconnections connecting themicrophones to the audio processing components can be fabricated as partof the display substrate.

Displays with microphones integrated into the display area as describedherein can perform various audio processing tasks. For example, displaysin which multiple front-facing microphones are distributed over thedisplay area can perform beamforming or spatial filtering on audiosignals generated by the microphones to allow for far-field capabilities(i.e., enhanced detection of sound generated by a remote acousticsource). Audio processing components can determine the location of aremote audio source, select a subset of microphones based on the audiosource location, and utilize audio signals from the selected subset ofmicrophones to enhance detection of sound received at the display fromthe audio source. In some embodiments, the audio processing componentscan determine the location of an audio source by determining delays tobe added to audio signals generated by various combinations ofmicrophones such that the audio signals overlap in time and theninferring the distance to the audio source from each microphone in thecombination based on the added delay to each audio signal. By adding thedetermined delays to the audio signals provided by the microphones,audio detection in the direction of the remote audio source can beenhanced. A subset of the total number of microphones in a display canbe used in beamforming or spatial filtering, and microphones notincluded in the subset can be powered off to reduce power. Beamformingcan similarly be performed using rear-facing microphones distributedacross the back side of the display substrate. As compared to displayshaving a few microphones incorporated into a display bezel, displayswith microphones integrated into the display area are capable ofimproved beamforming due to the greater number of microphones that canbe integrated into the display and being spread over a greater area.

In some embodiments, a display is configured with a set of rear-facingmicrophones distributed across the display area that allows for acloseable device incorporating the display (such as a laptop ornotebook) to have audio detection capabilities when the display isclosed. For example, a closed device can be in a low-power mode in whichthe rear-facing microphones and audio processing components capable ofperforming key phrase detection are enabled. The audio processingcomponents wait for the detection of a key phrase to be uttered andwakes the audio processing components (that is, causes them to ahigh-power mode) to enable a voice interface or other functionalities.

In some embodiments, a display comprising both front- and rear-facingmicrophones can utilize both types of microphones for noise reduction,enhanced audio detection (far field audio), and enhanced audiorecording. For example, if a user is operating a laptop in a noisyenvironment, such as a coffee shop or cafeteria, audio signals from oneor more rear-facing microphones picking up ambient noise can be used toreduce noise in an audio signal provided by a front-facing microphonecontaining the voice of the laptop user. In another example, an audiorecording made by a device containing such a display can include audioreceived by both front- and rear-facing microphones. By including audiocaptured by both front- and rear-facing microphones, such a recordingcan provide a more accurate audio representation of the recordedenvironment. In further examples, a display comprising both front- andrear-facing microphones can provide for 360-degree far field audioreception. For example, the beamforming or spatial filtering approachesdescribed herein can be applied to audio signals provided by both front-and rear-facing microphones to provide enhanced audio detection.

In some embodiments, information indicating the location or direction ofan audio source relative to a display can be included as part of arecording of sound received at one or more microphones incorporated in adisplay. Audio source location or directional information can be used byan audio playback device capable of generating directional audioplayback to generate audio output that reproduces the spatiality of theaudio recorded by the audio recording device. In other embodiments, thespatiality of audio received at a device can be captured by recordingthe audio signals provided by multiple speakers incorporated in thedevice along with positional information for the multiple speakers. Thepositional information for the speakers can indicate each speaker'sphysical location within the display or relative position to otherspeakers. An audio playback device can reproduce the spatiality of therecorded audio by playing the recorded audio across a set of speakersthat have a positional arrangement the same or similar to those used inthe recording.

FIG. 5 illustrates an exemplary method for enhancing the audio detectioncapabilities of a display. The method 500 can be performed by, forexample, a laptop display having an array of 24 integrated microphonesdistributed across the display area, and audio processing componentslocated in the display that is receiving sound generated by a personlocated ten feet away and off to the right of the display. In 510, anaudio source location based at least in part on audio signalscorresponding to at least one of the microphones is determined. In theexample, the audio processing components in the display determine thelocation of the person based on audio signals corresponding to acombination of microphones in the display. The audio processingcomponents determine the location of the person by determining thedelays to be added to the audio signals such that the audio signalsoverlap in time and then inferring the distance from each microphone tothe person based on the delay added to each signal. In the example, theaudio processing components determine that smaller delays need to beadded to audio signals provided by microphones located on the right sideof the display (located nearer to the person) and that longer delaysneed to be added to audio signals provided by microphones located on theleft side of the display (located further away from the person) for theaudio signals to align. Based on the delays the audio processingcomponents add to each audio signal to get them to align, the audioprocessing components determine that person is located approximately 10feet away and off to the right from the display.

In 520, a subset of microphones is selected based on the determinedaudio source location. In the example, the audio processing componentsdetermine that a set of 12 microphones located across the display areacan provide enhanced detection of sound generated by the person andselects those 12 microphones for enhanced detection of further soundreceived at the display generated by the person. In 530, audio signalscorresponding to the subset of microphones are utilized to enhance thedetection of sound received at the display from the audio source. In theexample, the audio processing components utilize the audio signalscorresponding to the subset of 12 microphones for enhanced detection ofsound generated by the person.

In other embodiments, the method 500 can comprise fewer, alternative, ormore actions. For example, in some embodiments, the method 500 canfurther power down the microphones that are not included in the subsetof microphones selected for enhanced audio detection.

Thus, displays with integrated microphones located within the displayarea have advantages over displays with microphones located in a displaybezel. Displays with microphones located in the display area can have anarrower bezel as bezel space is not needed for housing the integratedmicrophones. Displays with reduced bezel width can be more aestheticallypleasing to a viewer and allow for a larger display area within a givendisplay housing size. Opening up the display area for the integration ofmicrophones allows for a greater number of microphones to be included ina device, which can allow for improved audio detection and noisereduction. Moreover, displays that have microphones located across thedisplay area allow for displays with enhanced audio detectioncapabilities through the use of beamforming or spatial filtering ofreceived audio signals as described above. Further, the cost andcomplexity of routing audio signals from microphones located in thedisplay area to audio processing components that are also located in thedisplay area can be less than wiring discrete microphones located in adisplay bezel to audio processing components located external to thedisplay.

Further, the integration of audio processing components in the displayallows for the offloading of audio processing from processors externalto the display. Offloading of audio processing to the display can bemore attractive than other media offloading solutions (e.g., Chromecast)that require extensive ecosystem enabling for applications to use themedia offloading.

Piezoelectric elements can also be incorporated into a display.Piezoelectric materials have the property that they create an electriccharge when subjected to mechanical stress. This piezoelectric effectallows for the translation of mechanical energy to electrical energy.Piezoelectric materials also exhibit a reverse piezoelectric effect thatallows for the conversion of electrical energy to mechanical energy. Thereverse piezoelectric effect can be used to create piezoelectricelements, such as piezoelectric speakers or buzzers, that can provideaudio output or a haptic signal to a user by applying an alternatingvoltage across the piezoelectric material.

FIGS. 6A and 6B illustrate an exemplary piezoelectric element undervarious conditions. The piezoelectric element 600 comprises electrodes610 and 620 on either side of a piezoelectric layer 630, and a diaphragm640. Application of a voltage differential across the piezoelectriclayer 630 causes deformation of the piezoelectric layer 630 (FIG. 6A) ina first direction and reversing the polarity of the applied voltagedifferential causes deformation in the opposite direction (FIG. 6B). Theamounts of deformation shown in FIGS. 6A and 6B are exaggerated toillustrate the piezoelectric effect and are not representative of theamount of deformation that can occur in a piezoelectric element. Inpractical applications, a piezoelectric element may deform less thanshown in FIGS. 6A and 6B.

The diaphragm 640 amplifies piezoelectric element vibrations. In someembodiments diaphragm 640 is a metal plate. If an alternating voltage isapplied across the piezoelectric layer 630, the piezoelectric element600 will vibrate. If the frequency of vibration of the piezoelectricelement 600 is within the range of frequencies audible to the human ear,the piezoelectric element 600 can act as a speaker or buzzer. Thediaphragm 640 can amplify the sound generated by the piezoelectricelement 600 by enabling the movement of a greater volume of air. In someembodiments, the piezoelectric element 600 can be a low-profile MEMS orNEMS (nanoelectromechanical systems) piezoelectric element and thepiezoelectric layer 630 can comprise any piezoelectric material capableof being deposited in thin films such as zirconate titanate (PZT) orlead magnesium niobite-lead titanate (PMN-PT). In other embodiments,piezoelectric layer 630 can comprise any type of piezoelectric material,a combination of piezoelectric materials, or combinations of one or morepiezoelectric materials with one or more non-piezoelectric materials.

In some embodiments, piezoelectric elements can have more layers thanshown in piezoelectric element 600. A piezoelectric element can haveintervening layers between the electrodes and a piezoelectric layer andthe electrodes and the diaphragm. Piezoelectric elements can havediaphragms of different sizes, shapes and can comprise multiple layersto create acoustic waves with desired characteristics. In someembodiments, resonators can be used to amplify the vibration of apiezoelectric element. In some embodiments, a piezoelectric element doesnot contain a diaphragm or any other component that amplifies thevibration of the piezoelectric layer or translates the vibration of thepiezoelectric layer to another frequency. In embodiments where thepiezoelectric element is attached to the body or a component of adevice, the vibration of the piezoelectric element can cause the deviceto vibrate enough to be felt by a user.

FIG. 7A illustrates a set of exemplary pixels with a piezoelectricelement located on the back side of a display substrate. Micro-LEDpixels 701-704 each have a red display element 711, a green displayelement 712, and a blue display element 713. A piezoelectric element 720is located on the back side of the display substrate and behind thepixels 701-704. As the piezoelectric element 720 is located on the backside of the display substrate, its placement is not constrained by thelocation of pixel display elements 711-713. In some embodiments,piezoelectric elements mounted on the back side of the display substratehave a minimum physical dimension of 0.5 mm.

FIG. 7B illustrates a cross-section of the exemplary pixels of FIG. 7Ataken along the line A-A′. Cross-section 750 illustrates the crosssection of pixels 701-702. The red display elements 712 andcorresponding electrodes 730 for the pixels 701 and 702 are located on adisplay substrate 760. The pixels 701-702 are covered by a transparentdisplay medium 770, which, in some embodiments, can comprise atouchscreen. The piezoelectric element 720 comprises electrodes 780 and781 on either side of a piezoelectric layer 790 with diaphragm 794positioned between the electrode 780 and the display substrate 760.Although piezoelectric element 720 is shown as spanning over only a fewpixels, a piezoelectric element located on the back of a displaysubstrate can span over more than a few pixels. The number and size ofpiezoelectric elements incorporated into a display area can depend on,for example, whether a coarse or fine level of localized haptic feedbackis desired. For example, in a dual-display laptop, piezoelectricelements can span the number of pixels across which a key of a virtualkeyboard is to be rendered. In another example, a large number ofclosely spaced smaller piezoelectric elements can be incorporated into adisplay to provide a more granular localized haptic response as part ofan operating system, a video game, or another context in which hapticfeedback may be desired at a precise location.

A system comprising piezoelectric elements integrated into a display canprovide a localized haptic response by determining the location of atouch to the display and causing one or more piezoelectric elementslocated at or in the vicinity of the touch location to vibrate.Localized haptic feedback can be provided by the piezoelectric element750 to a user through application of an alternating voltage differentialto the electrodes 780 and 781, which causes the piezoelectric layer 790to vibrate, which in turn causes vibration of the diaphragm 794, whichin turn causes the display to vibrate in the vicinity of thepiezoelectric element 720. This haptic response can be provided beforethe finger, stylus or other object touching the display is removed fromthe display. In some embodiments, multiple piezoelectric elementslocated in the vicinity of the touch location can be simultaneouslyactivated to provide for stronger haptic feedback to a user.

In some embodiments, circuitry to drive a piezoelectric element islocated adjacent to or within the vicinity of the piezoelectricelements. In other embodiments, the circuitry driving individualpiezoelectric elements is centralized but still located within thedisplay. In yet other embodiments, the circuitry driving piezoelectricelements is located external to the display.

Piezoelectric elements can be integrated on the front side of thedisplay substrate in embodiments where there is enough space toaccommodate piezoelectric elements in the black matrix area. In theseembodiments, the piezoelectric elements are arranged with one of theelectrodes positioned adjacent to the front side of the displaysubstrate and with the diaphragm adjacent to the other electrode. Thetransparent display medium in a region above a piezoelectric element canhave holes to allow for acoustic waves generated by the piezoelectricelement to be transmitted to the environment without having to betransmitted through the transparent display medium layers. Piezoelectricelements located on the back side of the display substrate can also beused as speakers to deliver audio to the front of the display.Rear-facing piezoelectric elements can also be used as microphones.Mechanical energy in the form of acoustic waves reaching a piezoelectricelement can be converted by the piezoelectric element into audio signalsthat are provided to audio processing components incorporated into thedisplay. Audio signals provided by piezoelectric elements to audioprocessing components can be processed in any manner described hereinwith reference to audio signals provided by microphones anddisplay-integrated piezoelectric elements can be employed in any mannerdescribed herein with reference to how displayed-integrated microphonescan be employed.

Piezoelectric elements can be used as speakers as well as for providinglocalized haptic feedback. For example, with reference to piezoelectricelement 720, the vibrations of the diaphragm 794 can propagate throughthe display substrate 760, through the air gaps 796 between the frontside of the display substrate and the transparent display medium,through the transparent display medium, and into the environment infront of the display. In other embodiments, a piezoelectric elementacting as a rear-facing speaker could have the structure ofpiezoelectric element 720 but with a second diaphragm located adjacentto the electrode located further away from the display substrate. In yetother embodiments, a piezoelectric element acting as a rear-facingspeaker could have the structure of piezoelectric element 720 but with asingle diaphragm located adjacent to the electrode located further awayfrom the display substrate. The sound generated by piezoelectricelements acting a rear-facing speaker can propagate through vents orother openings in the back of the display housing or by propagationthrough the display housing.

Piezoelectric elements distributed across a display can allow for thecreation of local sound effects. For example, a user attempting toselect an icon that is not presently selectable could hear a buzz orother noise that emanates from the location of the display where theicon is rendered. In larger displays, sound effects can be created usingmultiple piezoelectric elements to create stereophonic sound effects.

FIGS. 8A-8C illustrate exemplary arrangements of piezoelectric elementsin a display. FIG. 8A illustrates a display 800 in which an array ofpiezoelectric elements 810 are distributed across a display area 820.FIG. 8B illustrates a display 850 in which an array of piezoelectricelements 860 occupy a lower portion of a display area 870. The displays800 and 850 (as well as any other displays comprising integratedpiezoelectric elements as described herein) can be stand-alone displays(e.g., computer monitors in wired or wireless communication withlaptops, notebooks, smartphones, tablets), displays integrated intomobile devices (e.g., single- and dual-display laptops or notebooks,tablets, smartphones), embedded displays (e.g., IVI systems, kiosks), orother types of display (e.g., television sets, commercial displays,gaming consoles, point-of-sale (POS) systems).

An arrangement of piezoelectric elements such as illustrated in FIG. 8Acan be used where localized haptic feedback is desired across the fullextent of a display area. An arrangement of piezoelectric elements suchas shown in FIG. 8B can be used where localized haptic feedback may beneeded for only a portion of a display area. For example, the display850 could be the base of a dual-display laptop with the piezoelectricelements 860 located in the portion of the display area 870 in which avirtual keyboard can be rendered, to allow for localized haptic feedbackto a user while typing on the virtual keyboard.

Displays integrating piezoelectric elements for providing localizedhaptic feedback typically also comprise touchscreens that allow for thedetection of an object (e.g., finger, stylus) touching the displaysurface (e.g., display surface 795 in FIG. 7B and display surface 475 inFIG. 4B) and determining where the touch has occurred on the display.Existing touchscreen technologies (e.g., resistance-based,capacitance-based) can be used for making displays described herein astouch-enabled. Some existing touchscreen technologies comprise multiplelayers that reside on a glass display substrate and others areintegrated into a display substrate (such as in AMOLED (active matrixOLED) in-cell displays). As used herein, the term “transparent displaymedium” includes any touchscreen layers, regardless of whether thetouchscreen layers are located on top of a display substrate or adisplay substrate layer is used as part of a touchscreen.

Regardless of the touchscreen technology used, touch informationprovided by the touchscreen can be used to determine a touch location,the location where a touch has occurred on the display. Touchinformation can be signals provided by individual touchscreen components(such as a touchscreen sensor) or signals generated by touchscreen (suchas a touchscreen controller) components based on the signals provided bythe individual touchscreen components. For example, touch informationcan be analog signals provided by a touchscreen sensor or digitalsignals provided by a touchscreen controller based on analog signalsprovided to the controller by the touchscreen sensor. In someembodiments, a touchscreen controller can determine a touch location. Inother embodiments, touch information is sent to a processor locatedexternal to the display to determine a touch location. One or morepiezoelectric elements can be activated at the touch location or in thevicinity of the touch location to provide local haptic feedback to auser.

The placement of piezoelectric elements in displays provides for varioushaptic feedback use cases. In a first use case, piezoelectric elementscan provide local haptic feedback to a user typing on a virtual keyboardrendered on a display. The haptic feedback can be provided in real-timeto the user (i.e., while the user is still touching the key). Suchlocalized haptic feedback can provide a user with a virtual keyboardingexperience that more closely mimics that of using a physical keyboard.It can also provide confirmation to the user that individual keyboardstrokes have been registered. The haptic feedback can be of fixedduration or it can last as long as the user is touching a key.

In some embodiments, touch information provided by a touchscreen can beused to determine a touch strength indicating the amount of force beingapplied to the display surface during a touch event and a piezoelectricelement can be activated to vibrate with an amplitude based on the touchstrength. For example, if a user typing on a virtual keyboard renderedon a display comprising a touchscreen capable of providing an indicationof how much force is being applied by an object to the display, themagnitude of the haptic feedback provided to the user can be based onhow hard the user taps each virtual key. That is, a harder keystrokeresults in a stronger haptic response and a softer keystroke results ina weaker haptic response. In other embodiments, a stronger hapticfeedback response is provided by activating multiple piezoelectricelements.

In some embodiments, the piezoelectric elements can provide touchinformation to determine a touch location. Touch information can besignals provided by individual piezoelectric elements or signalsgenerated by a processor (located either in the display or external tothe display) based on the signals provided by the individualpiezoelectric elements. For example, touch information can be analogsignals provided by a piezoelectric element or digital signals providedby a processor based on analog signals provided to the controller by apiezoelectric element.

The touch information provided piezoelectric elements can also providetouch strength information. For example, piezoelectric elements locatedon the back side of a display substrate can be subjected to pressureresulting from a user touching, grabbing, or otherwise manipulating adisplay or a device incorporating a display with integratedpiezoelectric elements. The magnitude of the electrical responsegenerated by a piezoelectric element in response to being subjected tomechanical energy can represent the touch strength. Touch strengthinformation provided by piezoelectric elements can be used in a varietyof applications. For example, touch strength can be used by a device todetermine which among various touches to the display or device thedevice should act upon. For example, if a user is holding a tablet withtwo hands and all four fingers of each hand are in contact with the backof the tablet, all eight fingers could be triggering responses bypiezoelectric elements in the tablet. If the user applies more pressureagainst the back of the table with, for example, the index finger oftheir left hand to control a game being played, the tablet can determinethat the touch made by the left index finger is the input the tabletshould act upon because the touch strength of the left index fingertouch is the strongest among the various touches. In another example,returning to the virtual keyboard example, a user could be touchingmultiple virtual keys at the same time while typing on a virtualkeyboard, thus causing a response in multiple piezoelectric elements,and the device can register as a key stroke the touch having thestrongest touch strength from among the multiple touches.

Other touch strength-based use cases are possible. For example, a devicecan only register a touch if the electrical signal provided by apiezoelectric element is above a threshold. In another example, alltouches are acted upon and the action taken by the device depends on thetouch strength. For example, the harder a user strikes the key of avirtual electronic musical keyboard, the louder a sound is played by thedevice. In another example, the harder a user strikes the key of avirtual keyboard while typing, the stronger the localized hapticfeedback response provided by the device.

In a second use case, piezoelectric elements can provide haptic feedbackthat provides confirmation that a desired action has been registered bythe system. For example, a system can confirm to the user that it hasregistered the touching of an application icon, the copying of selectedcontent, the dropping of a file into an on-screen trash icon, or amyriad of other touch-enabled operations via a localized hapticresponse.

In some embodiments, piezoelectric elements can be used as speakers.Several piezoelectric elements may need to be ganged together to be ableto create enough volume for the elements to collectively operate as asingle speaker. A group of piezoelectric elements can generatevibrations in a frequency range that is different from the frequencythat can be generated by another group of piezoelectric elements. FIG.8C illustrates an exemplary arrangement of piezoelectric elements inwhich sets of piezoelectric elements can act as speakers. The display880 comprises a set of piezoelectric elements 884 located in a lowerregion of a display area 886 and piezoelectric element sets 890, 891,and 892 located in the upper-left, upper-center, and upper-right of thedisplay area 886, respectively. The display 880 can be a largeflat-panel display in which the piezoelectric element sets 884, 890,891, and 892 operate as subwoofer, left-front, center, and right-frontchannels, respectively, of a surround sound system. The number andcharacteristics of the piezoelectric elements in each set can betailored to produce sounds in frequency ranges appropriate for theirrespective roles in a surround sound system. For example, to act as asubwoofer, the piezoelectric element set 884 can have a larger number ofelements that are capable of producing sounds in the lower range offrequencies audible to humans and the sets 890, 891, and 892 can havefewer number of piezoelectric elements that are capable of producingsounds in the middle and high range of frequencies audible to humans. Inother embodiments, the piezoelectric element set 884 can mimic a soundbar, which is typically positioned just below a television set ordisplay, and have various channel configuration, such as two subsets ofpiezoelectric elements that act as left and right speakers in atwo-channel configuration, three subsets that act as left, center, andright speakers in a three-channel configuration, and five subsets thatact as left, center, right and two back channel speakers in afive-channel configuration.

In some embodiments, beamforming techniques can be applied to a set ofpiezoelectric elements to allow for the directional transmission ofsound waves. For example, a system can activate a set ofdisplay-integrated piezoelectric elements to direct sound to adetermined location external to the display where a user has beendetermined to be located based on the application of beamformingtechniques applied to received audio signals, as described above. Thesystem can activate individual piezoelectric elements within the setsuch that the amplitude and phase of the audio vibrations generated bythe piezoelectric elements constructively interfere at the desiredlocation.

In some embodiments, piezoelectric elements can assist in the thermalmanagement of a display. For example, a display can have thermal sensorsintegrated into the display area and the display (or a system in whichthe display is incorporated) can determine that a specific location,region, or the display as a whole has exceeded a thermal threshold basedon thermal sensor data provided by the thermal sensors. In response,multiple piezoelectric elements can be activated in a coordinated mannerto create one or more acoustic waves internal to the display to moveheated air from within the display to the edge of the display where theexcess heat can dissipate to the external environment through a vent orother opening in the display housing. The air moved by acoustic wavescan be located between the back side of the display substrate and thedisplay housing.

The thermal sensors can be of any number, location, and arrangement inthe display area and can be located on either side of the displaysubstrate. The thermal sensors can provide thermal sensor data to adisplay thermal manager, which can be a processor or any otherprocessing component responsible for display thermal management of thedisplay located within or external to the display. If the displaythermal manager detects that the temperature of a specific location orregion within the display or the display as a whole has exceeded athreshold temperature, the display thermal manager can activatepiezoelectric elements to remove the excess heat. The display thermalmanager can activate the piezoelectric elements directly or send amessage to another processor in the display or located externally thatis responsible for activating the piezoelectric elements. Usingpiezoelectric elements to aid in display thermal management can alsoassist in the regulation of the surface temperature of the display dueto the proximity of piezoelectric elements to the display surface.

In some embodiments, piezoelectric elements can participate in displaythermal management to achieve a more uniform heat distribution in adisplay, even if no portion of the display is determined to haveexceeded thermal limits. Providing a more uniform heat distribution in adisplay can delay or prevent a location or region of the display fromexceeding thermal limits. For example, the system can determine fromthermal sensor data that the temperature of a first location of thedisplay exceeds the temperature of a second location or region of thedisplay by a threshold amount. The system can then move heated air awayfrom the first location to achieve a more uniform temperaturedistribution in the interior of the display. The heated air can be movedby acoustic waves generated by piezoelectric elements to the edge of thedisplay where the excess heat can be dissipated into the externalenvironment or to cooler locations or regions of the display.

In other embodiments, the system can monitor content being displayed andactivate piezoelectric elements to move air away from regions of thedisplay where the system determines that displaying the content isexpected to heat up the display. For example, a system can determinethat video content being displayed in a window rendered on a display islikely to cause thermal limits to be exceeded as the content of thedisplayed video is continuously changing rapidly (i.e., the pixeldisplay elements are repeatedly being turned on and off at a high rate).Piezoelectric elements can be activated to move air away from the regionof the display where the video is being played to prevent or delayoverheating.

In other embodiments, the system can analyze content before it isdisplayed to determine whether displaying the content may cause a regionof the display to overheat and activate piezoelectric elements to createone or more acoustic waves to move air away from the region where thecontent is to be displayed as soon as the content expected to causeoverheating begins to be displayed.

Piezoelectric elements can create an acoustic wave by successivelyactivating adjacent rows or columns of piezoelectric elements. Thesuccessive activation of piezoelectric element rows or columns cancreate a pressure wave in the air internal to the display that can moveheated air toward a display edge (or wherever there is a vent in thedisplay housing) where it can dissipate into the external environment.If a specific location or small region of the display is overheating,partial rows or partial columns of piezoelectric elements may beactivated to move the heated air. If a large region of the display orthe display as a whole is overheating, entire rows and columns ofpiezoelectric elements can be activated to create acoustic waves. Insome embodiments, the piezoelectric elements are activated atfrequencies inaudible to the human ear when activated to create acousticwaves to relieve overheating.

Thus, devices with piezoelectric elements integrated into a display haveadvantages over devices that either do not have piezoelectric elementsor have one or only a few haptic feedback devices. Some existing mobiledevices, such as smartphones, provide haptic feedback through the use oflinear or circular haptic motors using magnets and coils. Thepiezoelectric elements described herein are smaller than such existingapproaches. The distribution of multiple (up to many) integratedpiezoelectric elements across a display allows for localized hapticfeedback not possible in devices with a single haptic feedback deviceand enables new user experiences, such as providing haptic feedback to auser typing on a virtual keyboard.

FIG. 9 illustrates an exemplary method for providing localized hapticfeedback to a user of a virtual keyboard. The method 900 can beperformed, for example, by a dual-display laptop having piezoelectricelements integrated into a touch-enabled display incorporated into thebase of the laptop and upon which a virtual keyboard can be rendered. At910, a virtual keyboard is rendered on the display. In the example, avirtual keyboard is rendered on the display in the laptop base. At 920,the location of a virtual key of the virtual keyboard touched by a useris determined based on touch information provided by the display'stouchscreen. In the example, a user touches a key on the virtualkeyboard. The location of the touched key is determined based on touchinformation provided by the touchscreen in the display. At 930, one ormore of the piezoelectric elements located in the vicinity of thevirtual key location are caused to vibrate. In the example, the systemcauses the piezoelectric element closest to the location of the touchedkey to vibrate, providing a localized haptic feedback response to theuser. In other embodiments, the method 900 can comprise fewer,alternative, or more actions. For example, in some embodiments, themethod 900 can further determine a touch strength based on the touchinformation and cause the one or more piezoelectric elements located inthe vicinity of the touched key to vibrate with an amplitude based atleast in part on the touch strength.

FIG. 10 illustrates an exemplary computing system with sensorsintegrated into a display. The system 1000 comprises a display 1010comprising microphones 1020, piezoelectric elements 1030, thermalsensors 1040, touchscreen 1050, audio processing components 1060, andpiezoelectric elements driver 1070 or combinations thereof. Themicrophones 1020, piezoelectric elements 1030, thermal sensors 1040, andtouchscreen 1050 are located in the display area of the display 1010 andcan be of any type of microphone, piezoelectric element, thermal sensor,or touchscreen described or referenced herein. The audio processingcomponents 1060 are also located in the display area and can compriseone or more of the audio processing components described or referencedherein (audio codecs, DSPs, etc.). The piezoelectric elements driver1070 is also located in the display area and selectively activates thepiezoelectric elements 1030 to cause a localized haptic response at thedisplay. The piezoelectric elements driver 1070 can also create anon-localized haptic response using the piezoelectric elements 1030.That is, even though the piezoelectric elements 1030 are located atspecific locations within the display area, the piezoelectric elementsdriver 1070 can activate one or more of the piezoelectric elements 1030to provide haptic feedback that is independent of the location of atouch event. In some embodiments, a piezoelectric elements driver can belocated external to the display.

The system 1000 further comprises touch detection and location module1080, display thermal manager 1090, and audio beamforming module 1095located external to the display 1010. The touch detection and locationmodule 1080 can determine that the surface of the display has beentouched and the location of the touch on the display. The displaythermal manager 1090 can determine whether a location, region, or thedisplay as a whole exhibit overheating and causes piezoelectric elementsdriver 1070 to activate the piezoelectric elements 1030 to createacoustic waves in the display. The audio beamforming module 1095 canapply beamforming or spatial filtering techniques to enhance audiodetection capabilities of the display 1010 in a specific direction usingone or more of the microphones 1020 or to direct sound to a specificlocation external to the display 1010 using one or more of thepiezoelectric elements 1030. The integration of microphones andpiezoelectric elements into a single display can allow for beamformingof audio signals received by (via the microphones) and transmitted to(via the piezoelectric elements) a remote audio source. For example, alaptop with an open lid can use beamforming techniques to improve audiodetection of words spoken by someone located across the room from thelaptop and use beamforming techniques to direct sound effects, voice,music, or other audio content generated at the display toward thatperson. In other embodiments, any of the modules 1080 and 1095 anddisplay thermal manager 1090 or combinations thereof can be located inthe display 1010. The computing system 1000 can further comprise one ormore computer-readable media that stores instructions to cause the audioprocessor components 1060, the piezoelectric elements driver 170, thetouch detection and location module 1080, the display thermal manager1090, or the audio beamforming module 1095 to carry out theirfunctionalities. These computer-readable media can be located in and/orexternal to the display 1010.

Although the system 1000 comprises various types of sensors—microphones,piezoelectric elements, a touchscreen, and thermal sensors—integratedinto a display, displays in other embodiments can have fewer integratedsensors. For example, a first display can have just microphone sensors,a second display can have piezoelectric elements and a touchscreen, anda third display can have piezoelectric elements, a touchscreen, andthermal sensors.

FIG. 10 illustrates one example of a set of modules that can be includedin a computing system or device. In other embodiments, a computingsystem or device can have more or fewer modules than those shown in FIG.10. Moreover, separate modules can be combined into a single module, anda single module can be split into multiple modules. Further, any of themodules shown in FIG. 10 can be part of the operating system of thecomputing system 1000, one or more software applications independent ofthe operating system, or operate at another software layer. The modulesshown in FIG. 10 can be implemented in software, hardware, firmware orcombinations thereof. A computer device or system referred to as beingprogrammed to perform a method can be programmed to perform the methodvia software, hardware, firmware or combinations thereof.

Although the display 1010 is shown in FIG. 10 as being part of thecomputing system 1000, any of the displays described or referencedherein can be referred to as a system.

The technologies, techniques, and embodiments described herein can beperformed by any of a variety of computing devices, including mobiledevices (e.g., smartphones, handheld computers, laptops, notebooks,tablets, media players, portable gaming consoles, cameras), non-mobiledevices (e.g., desktop computers, servers, stationary gaming consoles,set-top boxes, televisions) and embedded devices (e.g., devicesincorporated into a vehicle, home or place of business). As used herein,the term “computing devices” includes computing systems and includesdevices comprising multiple discrete physical components.

FIG. 11 is a block diagram of an exemplary computing device in whichtechnologies described herein may be implemented. Generally, componentsshown in FIG. 11 can communicate with other shown components, althoughnot all connections are shown, for ease of illustration. The device 1100is a multiprocessor system comprising a first processor 1102 and asecond processor 1104 and is illustrated as comprising point-to-point(P-P) interconnects. For example, a point-to-point (P-P) interface 1106of the processor 1102 is coupled to a point-to-point interface 1107 ofthe processor 1104 via a point-to-point interconnection 1105. It is tobe understood that any or all of the point-to-point interconnectsillustrated in FIG. 11 can be alternatively implemented as a multi-dropbus, and that any or all buses illustrated in FIG. 11 could be replacedby point-to-point interconnects.

As shown in FIG. 11, the processors 1102 and 1104 are multicoreprocessors. Processor 1102 comprises processor cores 1108 and 1109, andprocessor 1104 comprises processor cores 1110 and 1111. Processor cores1108-1211 can execute computer-executable instructions in a mannersimilar to that discussed below in connection with FIG. 12, or in othermanners.

Processors 1102 and 1104 further comprise at least one shared cachememory 1112 and 1114, respectively. The shared caches 1112 and 1114 canstore data (e.g., instructions) utilized by one or more components ofthe processor, such as the processor cores 1108-1209 and 1110-1211. Theshared caches 1112 and 1114 can be part of a memory hierarchy for thedevice 1100. For example, the shared cache 1112 can locally store datathat is also stored in a memory 1116 to allow for faster access to thedata by components of the processor 1102. In some embodiments, theshared caches 1112 and 1114 can comprise multiple cache layers, such aslevel 1 (L1), level 2 (L2), level 3 (L3), level 4 (L4), and/or othercaches or cache layers, such as a last level cache (LLC).

Although the device 1100 is shown with two processors, the device 1100can comprise any number of processors. Further, a processor can compriseany number of processor cores. A processor can take various forms suchas a central processing unit, a controller, a graphics processor, anaccelerator (such as a graphics accelerator or digital signal processor(DSP)) or a field programmable gate array (FPGA). A processor in adevice can be the same as or different from other processors in thedevice. In some embodiments, the device 1100 can comprise one or moreprocessors that are heterogeneous or asymmetric to a first processor,accelerator, FPGA, or any other processor. There can be a variety ofdifferences between the processing elements in a system in terms of aspectrum of metrics of merit including architectural,microarchitectural, thermal, power consumption characteristics and thelike. These differences can effectively manifest themselves as asymmetryand heterogeneity amongst the processors in a system. In someembodiments, the processors 1102 and 1104 reside in the same diepackage.

Processors 1102 and 1104 further comprise memory controller logic (MC)1120 and 1122. As shown in FIG. 11, MCs 1120 and 1122 control memories1116 and 1118 coupled to the processors 1102 and 1104, respectively. Thememories 1116 and 1118 can comprise various types of memories, such asvolatile memory (e.g., dynamic random access memories (DRAM), staticrandom access memory (SRAM)) or non-volatile memory (e.g., flashmemory). While MCs 1120 and 1122 are illustrated as being integratedinto the processors 1102 and 1104, in alternative embodiments, the MCscan be logic external to a processor and can comprise one or more layersof a memory hierarchy.

Processors 1102 and 1104 are coupled to an Input/Output (I/O) subsystem1130 via P-P interconnections 1132 and 1134. The point-to-pointinterconnection 1132 connects a point-to-point interface 1136 of theprocessor 1102 with a point-to-point interface 1138 of the I/O subsystem1130, and the point-to-point interconnection 1134 connects apoint-to-point interface 1140 of the processor 1104 with apoint-to-point interface 1142 of the I/O subsystem 1130. Input/Outputsubsystem 1130 further includes an interface 1150 to couple I/Osubsystem 1130 to a graphics engine 1152, which can be ahigh-performance graphics engine. The I/O subsystem 1130 and thegraphics engine 1152 are coupled via a bus 1154. Alternately, the bus1154 could be a point-to-point interconnection.

Input/Output subsystem 1130 is further coupled to a first bus 1160 viaan interface 1162. The first bus 1160 can be a Peripheral ComponentInterconnect (PCI) bus, a PCI Express bus, another third generation I/Ointerconnection bus or any other type of bus.

Various I/O devices 1164 can be coupled to the first bus 1160. A busbridge 1170 can couple the first bus 1160 to a second bus 1180. In someembodiments, the second bus 1180 can be a low pin count (LPC) bus.Various devices can be coupled to the second bus 1180 including, forexample, a keyboard/mouse 1182, audio I/O devices 1188 and a storagedevice 1190, such as a hard disk drive, solid-state drive or otherstorage devices for storing computer-executable instructions (code)1192. The code 1192 can comprise computer-executable instructions forperforming technologies described herein. Additional components that canbe coupled to the second bus 1180 include communication device(s) 1184,which can provide for communication between the device 1100 and one ormore wired or wireless networks 1186 (e.g. Wi-Fi, cellular or satellitenetworks) via one or more wired or wireless communication links (e.g.,wire, cable, Ethernet connection, radio-frequency (RF) channel, infraredchannel, Wi-Fi channel) using one or more communication standards (e.g.,IEEE 802.11 standard and its supplements).

The device 1100 can comprise removable memory such as flash memory cards(e.g., SD (Secure Digital) cards), memory sticks, Subscriber IdentityModule (SIM) cards). The memory in device 1100 (including caches 1112and 1114, memories 1116 and 1118 and storage device 1190) can store dataand/or computer-executable instructions for executing an operatingsystem 1194 and application programs 1196. Example data includes webpages, text messages, images, sound files, video data, biometricthresholds for particular users or other data sets to be sent to and/orreceived from one or more network servers or other devices by the device1100 via one or more wired or wireless networks, or for use by thedevice 1100. The device 1100 can also have access to external memory(not shown) such as external hard drives or cloud-based storage.

The operating system 1194 can control the allocation and usage of thecomponents illustrated in FIG. 11 and support one or more applicationprograms 1196. The application programs 1196 can include common mobilecomputing device applications (e.g., email applications, calendars,contact managers, web browsers, messaging applications) as well as othercomputing applications and utilities, such as a virtual keyboard.

The device 1100 can support various input devices, such as atouchscreen, microphones, camera, physical keyboard, virtual keyboard,proximity sensor and trackball, and one or more output devices, such asa speaker and a display. Other possible input and output devices includepiezoelectric and other haptic I/O devices. Any of the input or outputdevices can be internal to, external to or removably attachable with thedevice 1100. External input and output devices can communicate with thedevice 1100 via wired or wireless connections.

In addition, the computing device 1100 can provide one or more naturaluser interfaces (NUIs). For example, the operating system 1194 orapplications 1196 can comprise speech recognition logic as part of avoice user interface that allows a user to operate the device 1100 viavoice commands. Further, the device 1100 can comprise input devices andlogic that allows a user to interact with the device 1100 via a body,hand or face gestures. For example, a user's hand gestures can bedetected and interpreted to provide input to a gaming application.

The device 1100 can further comprise one or more communicationcomponents 1184. The components 1184 can comprise wireless communicationcomponents coupled to one or more antennas to support communicationbetween the system 1100 and external devices. The wireless communicationcomponents can support various wireless communication protocols andtechnologies such as Near Field Communication (NFC), Wi-Fi, Bluetooth,4G Long Term Evolution (LTE), Code Division Multiplexing Access (CDMA),Universal Mobile Telecommunication System (UMTS) and Global System forMobile Telecommunication (GSM). In addition, the wireless modems cansupport communication with one or more cellular networks for data andvoice communications within a single cellular network, between cellularnetworks, or between the mobile computing device and a public switchedtelephone network (PSTN).

The device 1100 can further include at least one input/output port(which can be, for example, a USB, IEEE 1394 (FireWire), Ethernet and/orRS-232 port) comprising physical connectors; a power supply; a satellitenavigation system receiver, such as a GPS receiver; a gyroscope; anaccelerometer; a proximity sensor; and a compass. A GPS receiver can becoupled to a GPS antenna. The device 1100 can further include one ormore additional antennas coupled to one or more additional receivers,transmitters and/or transceivers to enable additional functions.

It is to be understood that FIG. 11 illustrates only one exemplarycomputing device architecture. Computing devices based on alternativearchitectures can be used to implement technologies described herein.For example, instead of the processors 1102 and 1104, and the graphicsengine 1152 being located on discrete integrated circuits, a computingdevice can comprise an SoC (system-on-a-chip) integrated circuitincorporating multiple processors, a graphics engine and additionalcomponents. Further, a computing device can connect elements via bus orpoint-to-point configurations different from that shown in FIG. 11.Moreover, the illustrated components in FIG. 11 are not required orall-inclusive, as shown components can be removed and other componentsadded in alternative embodiments.

FIG. 12 is a block diagram of an exemplary processor core 1200 toexecute computer-executable instructions as part of implementingtechnologies described herein. The processor core 1200 can be a core forany type of processor, such as a microprocessor, an embedded processor,a digital signal processor (DSP) or a network processor. The processorcore 1200 can be a single-threaded core or a multithreaded core in thatit may include more than one hardware thread context (or “logicalprocessor”) per core.

FIG. 12 also illustrates a memory 1210 coupled to the processor 1200.The memory 1210 can be any memory described herein or any other memoryknown to those of skill in the art. The memory 1210 can storecomputer-executable instruction 1215 (code) executable by the processorcore 1200.

The processor core comprises front-end logic 1220 that receivesinstructions from the memory 1210. An instruction can be processed byone or more decoders 1230. The decoder 1230 can generate as its output amicro operation such as a fixed width micro operation in a predefinedformat, or generate other instructions, microinstructions, or controlsignals, which reflect the original code instruction. The front-endlogic 1220 further comprises register renaming logic 1235 and schedulinglogic 1240, which generally allocate resources and queues operationscorresponding to converting an instruction for execution.

The processor core 1200 further comprises execution logic 1250, whichcomprises one or more execution units (EUs) 1265-1 through 1265-N. Someprocessor core embodiments can include a number of execution unitsdedicated to specific functions or sets of functions. Other embodimentscan include only one execution unit or one execution unit that canperform a particular function. The execution logic 1250 performs theoperations specified by code instructions. After completion of executionof the operations specified by the code instructions, back-end logic1270 retires instructions using retirement logic 1275. In someembodiments, the processor core 1200 allows out of order execution butrequires in-order retirement of instructions. Retirement logic 1270 cantake a variety of forms as known to those of skill in the art (e.g.,re-order buffers or the like).

The processor core 1200 is transformed during execution of instructions,at least in terms of the output generated by the decoder 1230, hardwareregisters and tables utilized by the register renaming logic 1235, andany registers (not shown) modified by the execution logic 1250. Althoughnot illustrated in FIG. 12, a processor can include other elements on anintegrated chip with the processor core 1200. For example, a processormay include additional elements such as memory control logic, one ormore graphics engines, I/O control logic and/or one or more caches.

As used in any embodiment herein, the term “module” refers to logic thatmay be implemented in a hardware component or device, software orfirmware running on a processor, or a combination thereof, to performone or more operations consistent with the present disclosure. Softwaremay be embodied as a software package, code, instructions, instructionsets and/or data recorded on non-transitory computer readable storagemediums. Firmware may be embodied as code, instructions or instructionsets and/or data that are hard-coded (e.g., nonvolatile) in memorydevices. As used in any embodiment herein, the term “circuitry” cancomprise, for example, singly or in any combination, hardwiredcircuitry, programmable circuitry such as computer processors comprisingone or more individual instruction processing cores, state machinecircuitry, and/or firmware that stores instructions executed byprogrammable circuitry. Modules described herein may, collectively orindividually, be embodied as circuitry that forms a part of one or moredevices. Thus, any of the modules can be implemented as circuitry, suchas continuous itemset generation circuitry, entropy-based discretizationcircuitry, etc. A computer device referred to as being programmed toperform a method can be programmed to perform the method via software,hardware, firmware or combinations thereof.

Any of the disclosed methods can be implemented as computer-executableinstructions or a computer program product. Such instructions can causea computer or one or more processors capable of executingcomputer-executable instructions to perform any of the disclosedmethods. Generally, as used herein, the term “computer” refers to anycomputing device or system described or mentioned herein, or any othercomputing device. Thus, the term “computer-executable instruction”refers to instructions that can be executed by any computing devicedescribed or mentioned herein, or any other computing device.

The computer-executable instructions or computer program products, aswell as any data created and used during implementation of the disclosedtechnologies, can be stored on one or more tangible or non-transitorycomputer-readable storage media, such as optical media discs (e.g.,DVDs, CDs), volatile memory components (e.g., DRAM, SRAM), ornon-volatile memory components (e.g., flash memory, solid state drives,chalcogenide-based phase-change non-volatile memories).Computer-readable storage media can be contained in computer-readablestorage devices such as solid-state drives, USB flash drives, and memorymodules. Alternatively, the computer-executable instructions may beperformed by specific hardware components that contain hardwired logicfor performing all or a portion of disclosed methods, or by anycombination of computer-readable storage media and hardware components.

The computer-executable instructions can be part of, for example, adedicated software application or a software application that isaccessed via a web browser or other software application (such as aremote computing application). Such software can be read and executedby, for example, a single computing device or in a network environmentusing one or more networked computers. Further, it is to be understoodthat the disclosed technology is not limited to any specific computerlanguage or program. For instance, the disclosed technologies can beimplemented by software written in C++, Java, Perl, JavaScript, AdobeFlash, or any other suitable programming language. Likewise, thedisclosed technologies are not limited to any particular computer ortype of hardware.

Furthermore, any of the software-based embodiments (comprising, forexample, computer-executable instructions for causing a computer toperform any of the disclosed methods) can be uploaded, downloaded orremotely accessed in a variety of manners. For example, suchinstructions can be uploaded, downloaded or remotely accessed using theInternet, the World Wide Web, an intranet, cable (including fiber opticcable), magnetic communications, electromagnetic communications(including RF, microwave, and infrared communications), and electroniccommunications.

As used in this application and in the claims, a list of items joined bythe term “and/or” can mean any combination of the listed items. Forexample, the phrase “A, B and/or C” can mean A; B; C; A and B; A and C;B and C; or A, B and C. As used in this application and in the claims, alist of items joined by the term “at least one of” can mean anycombination of the listed terms. For example, the phrase “at least oneof A, B or C” can mean A; B; C; A and B; A and C; B and C; or A, B, andC.

The disclosed methods, apparatuses and systems are not to be construedas limiting in any way. Instead, the present disclosure is directedtoward all novel and nonobvious features and aspects of the variousdisclosed embodiments, alone and in various combinations andsubcombinations with one another. The disclosed methods, apparatuses,and systems are not limited to any specific aspect or feature orcombination thereof, nor do the disclosed embodiments require that anyone or more specific advantages be present or problems be solved.

Theories of operation, scientific principles or other theoreticaldescriptions presented herein in reference to the apparatuses or methodsof this disclosure have been provided for the purposes of betterunderstanding and are not intended to be limiting in scope. Theapparatuses and methods in the appended claims are not limited to thoseapparatuses and methods that function in the manner described by suchtheories of operation.

Although the operations of some of the disclosed methods are describedin a particular, sequential order for convenient presentation, it is tobe understood that this manner of description encompasses rearrangement,unless a particular ordering is required by specific language set forthherein. For example, operations described sequentially may in some casesbe rearranged or performed concurrently. Moreover, for the sake ofsimplicity, the attached figures may not show the various ways in whichthe disclosed methods can be used in conjunction with other methods.

The following examples pertain to additional embodiments of technologiesdisclosed herein.

Example 1 is a display comprising: a display substrate comprising afront side; a plurality of pixels located on the front side of thedisplay substrate, the plurality of pixels defining a display area; anda plurality of microphones located on the front side of the displaysubstrate.

Example 2 is the display of Example 1, wherein the plurality ofmicrophones are located within the display area.

Example 3 is the display of Example 2, wherein the microphones arelocated within a peripheral region of the display area.

Example 4 is the display of Example 2, wherein individual of the pixelsoccupy a pixel area and at least one of the microphones is locatedwithin a pixel area of one of the pixels.

Example 5 is the display of Example 2, wherein at least one of themicrophones spans multiple pixels.

Example 6 is the display of Example 2, wherein the display furthercomprises one or more audio processing components electrically coupledto the microphones.

Example 7 is the display of Example 6, wherein the one or more audioprocessing components comprise one or more analog-to-digital converters.

Example 8 is the display of Example 6, wherein the one or more audioprocessing components comprise one or more digital signal processors.

Example 9 is the display of Example 6, wherein the audio processingcomponents are capable of performing at least one of voice activitydetection, key phrase detection, or audio speech recognition.

Example 10 is the display of Example 2, wherein the display furthercomprises one or more audio processing components to: determine alocation of an audio source based at least in part on audio signalscorresponding to at least one of the microphones; select a subset of theplurality of microphones based on the location of the audio source; andutilize audio signals corresponding to the subset of microphones toenhance detection of sound received at the display from the audiosource.

Example 11 is the display of Example 10, the instructions to furthercause the one or more processors to power off the microphones notincluded in the subset of microphones.

Example 12 is the display of Example 1, wherein the display substratefurther comprises a back side and a plurality of rear microphoneslocated on the back side of the display.

Example 13 is the display of Example 12, the display further comprisingone or more audio processing components to: determine a location of anaudio source based at least in part on audio signals corresponding to atleast one of the rear microphones; select a subset of the plurality ofthe rear microphones based on the location of the audio source; andutilize audio signals corresponding to the subset of rear microphones toenhance detection of sound received at the display from the audiosource.

Example 14 is the display of Example 13, wherein the display is housedin a closeable computing device and the one or more audio processingcomponents are further to determine the location of the audio sourcelocation based at least in part on the audio signals corresponding tothe at least one of the rear microphones, select the subset of theplurality of the rear microphones based on the location of the audiosource, and utilize the audio signals corresponding to the subset ofrear microphones to enhance detection of the sound received at thedisplay from the audio source when the computing device is closed.

Example 15 is the display of Example 1, wherein the plurality of pixelsare micro-LED pixels.

Example 16 is the display of Example 1, wherein the plurality of pixelsare organic LED pixels.

Example 17 is the display of Example 1, wherein the display isincorporated in a housing that further houses one or more processors andone or more computer-readable media.

Example 18 is the display of Example 1, wherein the display isincorporated in a first housing coupled to a second housing that housesone or more processors and one or more computer-readable media.

Example 19 is the display of Example 1, further comprising a bezel,wherein at least one of the plurality of microphones is located withinthe bezel.

Example 20 is a method comprising: determining a location of an audiosource external to a display based at least in part on audio signalscorresponding to at least one of a plurality of microphones incorporatedinto the display and located within a display area of the display;selecting a subset of the plurality of microphones based on the locationof the audio source; and utilizing audio signals corresponding to thesubset of microphones to enhance detection of sound received at thedisplay from the audio source.

Example 21 is the method of claim 20, wherein the plurality ofmicrophones are front-facing microphones.

Example 22 is the method of claim 20, wherein the plurality ofmicrophones are rear-facing microphones.

Example 23 is the method of claim 22, wherein the display is housed in acloseable computing device and the determining the location of the audiosource, the selecting the subset of the plurality of microphones, andthe utilizing the audio signals are performed when the computing deviceis closed.

Example 24 is the method of claim 20, the method further comprisingpowering off the microphones not included in the subset of microphones.

Example 25 is a method comprising: performing key phrase detection byone or more audio processing components located within a display area ofa display based at least in part on audio signals corresponding to aplurality of microphones incorporated in the display and located withinthe display area; and causing a processor external to the display totransition from a low-power state to an active state in response to theone or more audio processing components detecting a key phrase.

Example 26 is one or more computer-readable storage media storingcomputer-executable instructions for causing a computer to perform anyof the methods of Examples 18-23.

Example 27 is a system comprising: a touchscreen comprising a displaysurface; a display substrate comprising a front side and a back side; aplurality of pixels located on the front side of the display substrate;and a plurality of piezoelectric elements located on the back side ofthe display substrate.

Example 28 is the system of Example 27, further comprising apiezoelectric elements driver to cause one or more of the piezoelectricelements to vibrate.

Example 29 is the system of Example 27, further comprising: at least oneprocessor; and one or more computer readable media comprisinginstructions stored thereon that when executed causes the at least oneprocessor to: determine a touch location on the display based at leastin part on touch information provided by the touchscreen; and cause oneor more of the piezoelectric elements located in a vicinity of the touchlocation to vibrate.

Example 30 is the system of Example 29, wherein the one or more computerreadable media comprising instructions stored thereon that when executedcause the at least one processor further to determine a touch strengthbased at least in part on the touch information, wherein the processorcauses the one or more piezoelectric elements located in the vicinity ofthe touch location to vibrate with an amplitude based at least in parton the touch strength.

Example 31 is the system of Example 27, further comprising: at least oneprocessor; and one or more computer readable media comprisinginstructions stored thereon that when executed causes the at least oneprocessor to: determine a touch location on the display based at leastin part on touch information provided by one or more of thepiezoelectric elements; and cause at least one of the piezoelectricelements located in a vicinity of the touch location to vibrate.

Example 32 is the system of Example 31, wherein the one or more computerreadable media comprising instructions stored thereon that when executedcause the at least one processor further to determine a touch strengthbased at least in part on touch strength information provided by the oneor more piezoelectric elements, wherein the processor causes the atleast one piezoelectric elements located in the vicinity of the touchlocation to vibrate with an amplitude based at least in part on thetouch strength.

Example 33 is the system of Example 27, further comprising: at least oneprocessor; and one or more computer readable media comprisinginstructions stored thereon that when executed causes the at least oneprocessor to: render a virtual keyboard on the display; determine, basedat least in part on touch information provided by the touchscreen, thelocation of a virtual key of the virtual keyboard touched by a user; andcause one or more of the piezoelectric elements located in a vicinity ofthe virtual key location to vibrate.

Example 34 is the system of Example 27, further comprising: at least oneprocessor; and one or more computer readable media comprisinginstructions stored thereon that when executed causes the at least oneprocessor to: determine a location external to the display at whichacoustic vibrations generated by one or more of the piezoelectricelements are to be directed; and cause the one or more piezoelectricelements to generate acoustic vibrations that constructively interfereat the determined location.

Example 35 is the system of Example 27, wherein at least one of thepiezoelectric elements comprises a metal plate.

Example 36 is the system of Example 27, wherein one or more of thepiezoelectric elements are located in a lower region of the display andare capable of vibrating in a lower range of frequencies audible tohumans.

Example 37 is the system of Example 27, wherein piezoelectric elementsin a first group of the piezoelectric elements can generate vibrationswithin a first frequency range and piezoelectric elements in a secondgroup of the piezoelectric elements can generate vibrations within asecond frequency range, the first frequency range being different thanthe second frequency range.

Example 38 is the system of Example 27, further comprising: one or morethermal sensors; at least one processor; and one or more computerreadable media comprising instructions stored thereon that when executedcauses the at least one processor to: determine that the temperature ata location in the display exceeds a temperature threshold based at leaston thermal sensor data provided by the one or more thermal sensors; andcause one or more of the piezoelectric elements to generate at least oneacoustic wave to move air in the display away from the location in thedisplay that exceeds the temperature threshold.

Example 39 is the system of Example 38, wherein at least one of thethermal sensors are located on the front side of the display substrate.

Example 40 is the system of Example 27, further comprising: one or morethermal sensors; at least one processor; and one or more computerreadable media comprising instructions stored thereon that when executedcauses the at least one processor to: determine that the temperature ata first location in the display exceeds the temperature of a secondlocation of the display based on thermal sensor data provided by the oneor more thermal sensors; and cause one or more of the piezoelectricelements to generate one or more acoustic waves to move air in thedisplay away from the first location in the display.

Example 41 is the system of Example 27, further comprising: a processor;one or more computer-readable media; and a housing that houses theprocessor, the one or more computer-readable media, and the display.

Example 42 is the system of Example 27, further comprising: a processor;one or more computer-readable media; a first housing that houses theprocessor and the one or more computer-readable media; and a secondhousing that houses the display.

Example 43 is a system comprising: a touchscreen comprising a displaysurface; a display substrate comprising a front side and a back side; aplurality of pixels located on the front side of the display substrate;and a haptic feedback means to provide localized haptic feedback.

Example 44 is the system of Example 43, further comprising: at least oneprocessor; and one or more computer readable media comprisinginstructions stored thereon that when executed causes the at least oneprocessor to determine a touch location on the display based at least inpart on touch information provided by the touchscreen; wherein thehaptic feedback means is to provide the localized haptic feedback in avicinity of the touch location.

Example 45 is the system of Example 44, wherein the one or more computerreadable media comprises instructions stored thereon that when executedcause the at least one processor further to determine a touch strengthbased at least in part on the touch information, wherein the strength ofthe localized haptic feedback is based at least in part on the touchstrength.

Example 46 is a method comprising: determining a touch location on adisplay comprising a touchscreen, the determining based at least in parton touch information provided by the touchscreen; and causing one ormore piezoelectric elements located in a vicinity of the touch locationto vibrate, the piezoelectric elements located on the back side of adisplay substrate of the display.

Example 47 is the method of Example 46, further comprising determining atouch strength based on the touch information, wherein the one or morepiezoelectric elements located in the vicinity of the touch locationvibrate with an amplitude based at least in part on the touch strength.

Example 48 is the method of Example 46, further comprising: determiningthat the temperature at a location in the display exceeds a temperaturethreshold based at least on thermal sensor data provided by one or morethermal sensors incorporated into the display and located within adisplay area of the display; and causing one or more of thepiezoelectric elements to generate at least one acoustic wave to moveair in the display away from the location in the display that exceedsthe temperature threshold.

Example 49 is the method of Example 46, further comprising: determiningthat the temperature at a location in the display exceeds a temperatureof a second location of the display based at least in part on thermalsensor data provided by one or more thermal sensors incorporated intothe display and located within a display area of the display; andcausing one or more of the piezoelectric elements to generate at leastone acoustic wave to move air in the display away from the firstlocation in the display.

Example 50 is a method comprising: rendering a virtual keyboard on adisplay comprising a touchscreen; determining, based on touchinformation provided by the touchscreen, the location of a virtual keyof the virtual keyboard touched by a user; and causing one or more ofthe piezoelectric elements located in a vicinity of the virtual keylocation to vibrate, the piezoelectric elements located on the back sideof a display substrate of display.

Example 51 is one of more computer-readable media having instructionsstored thereon that when executed cause one or more processors toperform the method of any of Examples 46-50.

We claim:
 1. A display comprising: a display substrate comprising afront side; a plurality of pixels located on the front side of thedisplay substrate, the plurality of pixels defining a display area; anda plurality of microphones located on the front side of the displaysubstrate.
 2. The display of claim 1, wherein the plurality ofmicrophones are located within the display area.
 3. The display of claim2, wherein the microphones are located within a peripheral region of thedisplay area.
 4. The display of claim 2, wherein individual of thepixels occupy a pixel area and at least one of the microphones islocated within a pixel area of one of the pixels.
 5. The display ofclaim 2, wherein at least one of the microphones spans multiple pixels.6. The display of claim 2, wherein the display further comprises one ormore audio processing components electrically coupled to themicrophones.
 7. The display of claim 6, wherein the one or more audioprocessing components comprise one or more analog-to-digital converters.8. The display of claim 6, wherein the one or more audio processingcomponents comprise one or more digital signal processors.
 9. Thedisplay of claim 6, wherein the audio processing components are capableof performing at least one of voice activity detection, key phrasedetection, or audio speech recognition.
 10. The display of claim 2,wherein the display further comprises one or more audio processingcomponents to: determine a location of an audio source based at least inpart on audio signals corresponding to at least one of the microphones;select a subset of the plurality of microphones based on the location ofthe audio source; and utilize audio signals corresponding to the subsetof microphones to enhance detection of sound received at the displayfrom the audio source.
 11. The display of claim 10, the instructions tofurther cause the one or more processors to power off the microphonesnot included in the subset of microphones.
 12. The display of claim 1,wherein the display substrate further comprises a back side and aplurality of rear microphones located on the back side of the display.13. The display of claim 12, the display further comprising one or moreaudio processing components to: determine a location of an audio sourcebased at least in part on audio signals corresponding to at least one ofthe rear microphones; select a subset of the plurality of the rearmicrophones based on the location of the audio source; and utilize audiosignals corresponding to the subset of rear microphones to enhancedetection of sound received at the display from the audio source. 14.The display of claim 13, wherein the display is housed in a closeablecomputing device and the one or more audio processing components arefurther to determine the location of the audio source location based atleast in part on the audio signals corresponding to the at least one ofthe rear microphones, select the subset of the plurality of the rearmicrophones based on the location of the audio source, and utilize theaudio signals corresponding to the subset of rear microphones to enhancedetection of the sound received at the display from the audio sourcewhen the computing device is closed.
 15. The display of claim 1, whereinthe plurality of pixels are micro-LED pixels.
 16. The display of claim1, wherein the display is incorporated in a housing that further housesone or more processors and one or more computer-readable media.
 17. Thedisplay of claim 1, wherein the display is incorporated in a firsthousing coupled to a second housing that houses one or more processorsand one or more computer-readable media.
 18. The display of claim 1,further comprising a bezel, wherein at least one of the plurality ofmicrophones is located within the bezel.
 19. A method comprising:determining a location of an audio source external to a display based atleast in part on audio signals corresponding to at least one of aplurality of microphones incorporated into the display and locatedwithin a display area of the display; selecting a subset of theplurality of microphones based on the location of the audio source; andutilizing audio signals corresponding to the subset of microphones toenhance detection of sound received at the display from the audiosource.
 20. The method of claim 19, wherein the plurality of microphonesare front-facing microphones.
 21. A method comprising: performing keyphrase detection by one or more audio processing components locatedwithin a display area of a display based at least in part on audiosignals corresponding to a plurality of microphones incorporated in thedisplay and located within the display area; and causing a processorexternal to the display to transition from a low-power state to anactive state in response to the one or more audio processing componentsdetecting a key phrase.
 22. One or more computer-readable storage mediastoring computer-executable instructions for causing a computer toperform a method, the method comprising: determining a location of anaudio source external to a display based at least in part on audiosignals corresponding to at least one of a plurality of microphonesincorporated into the display and located within a display area of thedisplay; selecting a subset of the plurality of microphones based on thelocation of the audio source; and utilizing audio signals correspondingto the subset of microphones to enhance detection of sound received atthe display from the audio source.
 23. The one or more computer-readablestorage media of claim 22, wherein the plurality of microphones arerear-facing microphones.
 24. The one or more computer-readable storagemedia claim 24, wherein the display is housed in a closeable computingdevice and the determining the location of the audio source, theselecting the subset of the plurality of microphones, and the utilizingthe audio signals are performed when the computing device is closed.